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Size, Weight, and Power Optimized Design

  • Industry-Leading Thermal and Visible Camera Performance

    Collect high-speed, dual VGA radiometric thermal and HD visible imagery in all light conditions.

  • Built for Integrators

    Reduce development cost and time to market with a solution from a single, reliable supplier.

  • Optimize design and operation time with compact, lightweight, and low-power module.

    The performance, reliability and support expected from Teledyne FLIR and the industry’s most versatile HD+ LWIR camera portfolio.


Teal 2 sUAS Overview feat. Hadron 640R


Traffic Surveillance with Hadron 640R




Getting Started with NVIDIA Jetson Nano & FLIR Hadron 640R


Getting Started with Qualcomm RB5 and FLIR Hadron 640R

INTEGRATE THERMAL FASTER

Integrating Teledyne FLIR thermal camera modules is now easier with our library of how-to-videos, application notes, and our comprehensive support center with product drawings, datasheets, and more!

Learn more

WHAT IS THERMAL BY FLIR?

Thermal by FLIR is a cooperative product development and marketing program that supports original equipment manufacturers (OEMs) and product innovators who use FLIR thermal imaging sensors in their products. With Thermal by FLIR, let us help you create the next market-changing innovation to grow your business.

Learn more

Prism

The end-to-end computational imaging ecosystem that supports various AI-powered object detection and tracking capabilities and advanced image processing.

Find out how

INNOVATE WITH THE INDUSTRY'S BEST CORES

With industry-leading reliability, performance, size, weight, and power, they are ideal for defense, commercial, and security applications.

Find out how

Camera Model Selector

Sorting through more than 100+ models can be tricky. Try our "Camera Model Selector" to find the right solution.

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Specifications
Thermal Imaging Detector
Boson 640x512 pixels, 12µm pitch, USB 3.0, 2-lane MIPI
Temperature Accuracy
±5°C less, over 0°C to 100°C range.
Radiometry
Temperature Accuracy
±5°C less, over 0°C to 100°C range.
Imaging & Optical
EO Camera Optics
Effective Focal Length (EFL) 4.8 mm, 67° HFOV, F/# 1/2.3
EO Camera Sensor
9248 x 6944 pixels (64.2 MP), 0.7 µm pitch, 4-lane MIPI
EO Camera Video
Full resolution @ 60 Hz
IMU
ICM20602, I2C or SPI (selectable)
IR Camera Optics
Effective Focal Length (EFL) 13.6mm, 32° HFOV, F/# 1.0
IR Camera Video
Full resolution @ 60Hz
Thermal Imaging Detector
Boson 640x512 pixels, 12µm pitch, USB 3.0, 2-lane MIPI
Connections & Communications
Software Drivers
NVIDIA Jetson Nano
Qualcomm Snapdragon rb5
Qualcomm Snapdragon 865

*Contact Teledyne FLIR for latest software drivers
Electrical
Electrical Interface
Hirose DF40C-50DP-0.4V (51)
Example of mating connector: DF40HC(2.5)-50DS-0.4V (51)
Power
5V, typical power dissipation <1800 mW, Max <2900 mW
Mechanical
Mechanical Interface
Screw mount to back plate
Size (w/o lens)
35 x 49 x 45 mm (1.38” x 1.93” x 1.77”)
Weight
56 g
Environmental & Approvals
Environmental Sealing
IP54 (with the rear interfaces sealed)
Operational & Storage Temperature
-20°C to +60°C
Tested EMI Performance
FCC part 15 Class B
Media gallery
Getting Started with NVIDIA Jetson Nano
Getting Started with Qualcomm RB5
XPONENTIAL 2023 feat. Hadron 640R Dev Kits for NVIDIA and Qualcomm
Related Documents
Export Restrictions

Export Restrictions

The information contained in this page pertains to products that may be subject to the International Traffic in Arms Regulations (ITAR) (22 C.F.R. Sections 120-130) or the Export Administration Regulations (EAR) (15 C.F.R. Sections 730-774) depending upon specifications for the final product; jurisdiction and classification will be provided upon request.

Hadron™ 640R